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Thermopads® Triple Wrap Series

The TVA W3 version of the Thermopad® offers metallization wraps around input, output, and ground terminals with small contact pads on the backside. The process permits inspectable solder fillets when flip chip mounting. Our application note describes the mounting techniques to optimize RF performance, heat sinking, and mechanical support terminals for use with alternative high frequency attachment methods and space applications. This product is available with various plating options including RoHS compliant lead free silver over nickel plating, 60/40 low temperature solder plating or 60/40 solder fused finish for easy reflow processing.



TVA-W3 Specification Sheet
TVA-W3F Specification Sheet
TVA-W3S Specification Sheet


Triple Wrap TVA Packaging Specifications
 

Specifications

Size 3.12mm x 3.71mm [0.123in x 0.146in]
Impedance 50 Ohms
Frequency Range DC to 6 GHz
TCA Tolerance ±0.001 db/db/°C
VSWR (Typical) 1.30 to 1 GHz
Power Rating 2.0 Watts
Operating Temperature -55°C to 150°C
Substrate Alumina
Resistive Material Thick Film
Terminal Material Thick Film, Nickel Barrier with Solder Plate or Lead Free Finish.
Gold and Wire Bondable Options Available.