Smiths Interconnect

EMC & RF Labs are now Smiths Interconnect

Learn More >

High Reliability Thermopads® Triple Wrap Series

The HRT W3 version Thermopads® offers metallization wrap around input, output, and ground terminals with small contact pads on the backside. The process permits inspectable solder fillets when flip chip mounting. Our application notes describes the mounting techniques to optimize RF performance, heat sinking, and mechanical support terminals for use with alternative high frequency attachment methods and space applications. This product is available with various plating options including 60/40 low temperature solder plating or 60/40 solder fused finish for easy reflow processing. Parts may be ordered 100% tested to Group A with the option to add Group B, subgroup 1 and subgroup 2 or Group C.

HRT-W3 Specification Sheet
HRT-W3S Specification Sheet