Smiths Interconnect

EMC & RF Labs are now Smiths Interconnect

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Chip Terminations

EMC Technology offers a complete line of chip terminations handling RF power up to 800 watts and some designs operating to 26 Ghz.  These devices are offered in a variety of sizes and styles to accommodate most applications.  Substrate materials are Alumina, Aluminum Nitride and Beryllium Oxide.  (Also, please see our section on CVD Diamond terminations.) 


Features

  • Frequency Range from DC to 26 GHz
  • Power Handling up to 800 Watts
  • Choose BeO, ALN, Alumina and CVD Diamond Substrates
  • Tin/Lead, Lead Free, or Solder Fused Plated
  • Tape and Reel Packaging Available
  • High Reliability Versions Available