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High Reliability Chip Attenuators HR05 Wire Bond Gold Series



The series HR WB1 version of the Thermopad offers wire bondable terminals for use with alternative high frequency attachment methods and space applications.

HR05-WB1 Specification Sheet


Product Selection Table

 
PowerFrequencydB ValueVSWRLengthWidthHeightPart #
0.112.4191.50.0750.0610.016HR0519AWB1
0.112.4111.50.0750.0610.016HR0511AWB1
0.112.431.50.0750.0610.016HR0503AWB1
0.112.421.50.0750.0610.016HR0502AWB1
0.112.411.50.0750.0610.016HR0501AWB1
0.112.4201.50.0750.0610.016HR0520AWB1
0.112.4151.50.0750.0610.016HR0515AWB1
0.112.4181.50.0750.0610.016HR0518AWB1
0.112.4171.50.0750.0610.016HR0517AWB1
0.112.4161.50.0750.0610.016HR0516AWB1
0.112.4141.50.0750.0610.016HR0514AWB1
0.112.4131.50.0750.0610.016HR0513AWB1
0.112.4121.50.0750.0610.016HR0512AWB1
0.112.471.50.0750.0610.016HR0507AWB1
0.112.4101.50.0750.0610.016HR0510AWB1
0.112.491.50.0750.0610.016HR0509AWB1
0.112.461.50.0750.0610.016HR0506AWB1
0.112.481.50.0750.0610.016HR0508AWB1
0.112.451.50.0750.0610.016HR0505AWB1
0.112.441.50.0750.0610.016HR0504AWB1
0.112.401.50.0750.0610.016HR0500AWB1