Smiths Interconnect

EMC & RF Labs are now Smiths Interconnect

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High Reliability Chip Attenuators

Our attenuators are available in a low power chip package as well as a 0.250 sq high power BeO package. The input power ratings range from 0.1 to 120 watts. The attenuation values range from 0 dB to 20 dB. . Various terminal types are available including the high performance planar flip chip, “W3” and “SMT” triple wrap, “W1” single wrap, and wire bondable gold “WB1” and “WB2” styles. Choose “S” solder fused terminal plating using Sn62, “F” style lead free plating using Sn96 solder plating, and “G” version wire bondable thick film 99.6% gold finish.