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Chip Attenuators TS03 Wire Bond Gold Series

Platinum gold metallization wraps around ground terminal only. Full backside metallization and input and output terminals have gold metallization for wire bonding applications.

TS03-WB1 Specification Sheet

Wire Bond Gold TS03 (WB1) Packaging Specifications

 

Specifications

Size 3.12mm x 3.68mm [0.123in x 0.145in]
Impedance 50 Ohms
Frequency Range DC to 8 GHz
VSWR (Typical) 1.30
Power Rating 2.0 Watts
Operating Temperature -55°C to 150°C
Substrate Alumina
Resistive Material Thick Film
Terminal Material Thick Film, Nickel Barrier with Solder Plated or RoHS, Gold and Wire Bondable Options Available