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Chip Attenuators TS03 Triple Wrap Series

Metallization wraps around input, output, and ground terminals with small contact pads on the backside. The process permits inspectable solder fillets when flip chip mounting. Application Note 004 describes the mounting techniques to optimize RF performance, heat sinking, and mechanical support.



TS03-W3 Specification Sheet
TS03-W3F Specification Sheet
TS03-W3S Specification Sheet

 

Packaging Specifications

Specifications

Size 3.12mm x 3.73mm [0.123in x 0.147in]
Impedance 50 Ohms
Frequency Range DC to 8 GHz
VSWR (Typical) 1.30
Power Rating 2.0 Watts
Operating Temperature -55°C to 150°C
Substrate Alumina
Resistive Material Thick Film
Terminal Material Thick Film, Nickel Barrier with Solder Plate or RoHS, Gold and Wire Bondable Options Available