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Chip Attenuators TS03 Planar Series

Planar devices for flip chip mounting offers the best RF performance and most competitive cost.  The planar chip devices are available with several plating options including gold for wire bonding, RoHS compliant lead free silver over nickel finish, solder plate, or fused solder finish for easy reflow processing.



TS03 Specification Sheet
TS03-F Specification Sheet
TS03-S Specification Sheet

Packaging Specifications

 

Specifications

Size 3.10mm x 3.68mm [0.122in x 0.145in]
Impedance 50 Ohms
Frequency Range DC to 12.4 GHz
VSWR (Typical) 1.30
Power Rating 2.0 Watts
Operating Temperature -55°C to 150°C
Substrate Alumina
Resistive Material Thick Film
Terminal Material Thick Film, Nickel Barrier with Solder Plated or RoHS, Gold and Wire Bondable Options Available